The 3D surface measuring instrument easily, quickly and accurately measures the height and surface shape of 1nm to 10mm with a height resolution of 0.1nm using the interference of light. Compared to the contact method, there is no damage to the workpiece, and the height resolution is the same regardless of the lens magnification, so it is possible to measure more accurately than the confocal method. It is also faster and has a wider range of measurements than the AFM method.
ㆍ Simultaneous measurement of 2d and 3d shapes
ㆍ Measurement height, depth, step, line, circle, arc, angle, width, and distance
ㆍ Measurement area roughness, line roughness, and waveform
ㆍ Measurement scratches, abrasions, defects, cross-sections and volumes
ㆍ Height resolution : 0.1 nm
ㆍ Measurement with various FOV sizes
ㆍ Same resolution, regardless of magnification
ㆍ Various sample measurements such as transparent, translucent, and opaque are possible
ㆍ Easy, fast and precise measurement
ㆍ High reliability by Piezo and Closed loop
ㆍ Equipped with a function to monitor equipment status
ㆍ Excellent Gage R & R
| Stud Bump |
Height, Thickness, Depth,
Scratch, Roughness, Wave form, Warpage, Coplanarity, iameter, Width, Angle, Volume, Area and Roundness |
|---|---|
| CMP | |
| CVD | |
| Wafer |
| Substrate (Pad, Trace, Space, Anchor, Land, Ball Pad, Via Hole, Dimple, SR) |
Height, Thickness, Depth, Scratch, Roughness, Waveform, Warpage, Coplanarity, Diameter, Width, Angle, Volume, Area and Roundness |
|---|---|
| BGA |
| Photo Space |
Height, Thickness, Depth, Scratch, Roughness, Waveform, Warpage, Coplanarity,Diameter, Width, Angle, Volume, Area and Roundness |
|---|---|
| RGB | |
| TFT Pattern | |
| BLU | |
| Metal Jet | |
| Glass | |
| OLED |
| MEMS |
Height, Thickness, Depth, Scratch, Roughness, Waveform, Warpage, Coplanarity,Diameter, Width, Angle, Volume, Area and Roundness |
|---|---|
| Precision machine part |
|
| Laser Marking | |
| Inkjet | |
| Micro Lens | |
| Hardness | |
| Battery | |
| Bio | |
| RFID |
