3D Surface Measurement

Outline

The 3D surface measuring instrument easily, quickly and accurately measures the height and surface shape of 1nm to 10mm with a height resolution of 0.1nm using the interference of light. Compared to the contact method, there is no damage to the workpiece, and the height resolution is the same regardless of the lens magnification, so it is possible to measure more accurately than the confocal method. It is also faster and has a wider range of measurements than the AFM method.

Measurement

ㆍ Simultaneous measurement of 2d and 3d shapes

ㆍ Measurement height, depth, step, line, circle, arc, angle, width, and distance

ㆍ Measurement area roughness, line roughness, and waveform

ㆍ Measurement scratches, abrasions, defects, cross-sections and volumes

Features

ㆍ Height resolution : 0.1 nm

ㆍ Measurement with various FOV sizes

ㆍ Same resolution, regardless of magnification

ㆍ Various sample measurements such as transparent, translucent, and opaque are possible

ㆍ Easy, fast and precise measurement

ㆍ High reliability by Piezo and Closed loop

ㆍ Equipped with a function to monitor equipment status

ㆍ Excellent Gage R & R

Product principle

Field of Application

Stud Bump Height, Thickness, Depth, Scratch,
Roughness, Wave form, Warpage,
Coplanarity, iameter, Width, Angle,
Volume, Area and Roundness
CMP
CVD
Wafer
Substrate
(Pad, Trace, Space,
Anchor, Land,
Ball Pad, Via Hole,
Dimple, SR)
Height, Thickness, Depth, Scratch,
Roughness, Waveform, Warpage,
Coplanarity, Diameter, Width,
Angle, Volume, Area and Roundness
BGA
Photo Space Height, Thickness, Depth, Scratch,
Roughness, Waveform, Warpage,
Coplanarity,Diameter, Width,
Angle, Volume, Area and Roundness
RGB
TFT Pattern
BLU
Metal Jet
Glass
OLED
MEMS Height, Thickness, Depth, Scratch,
Roughness, Waveform, Warpage,
Coplanarity,Diameter, Width,
Angle, Volume, Area and Roundness
Precision
machine part
Laser Marking
Inkjet
Micro Lens
Hardness
Battery
Bio
RFID